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BD00KA5WF Scheda tecnica(PDF) 5 Page - Rohm |
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BD00KA5WF Scheda tecnica(HTML) 5 Page - Rohm |
5 / 10 page BD□□KA5,BD□□KA5W Series,BD00KA5W Series Technical Note 5/9 www.rohm.com 2009.04 - Rev.A © 2009 ROHM Co., Ltd. All rights reserved. ● Input / Output Equivalent Circuit Diagrams ● Thermal Design When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22. The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX. Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high, so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows : Pc = (Vcc-Vo)×Io+Vcc×Icca Acceptable loss Pd≧Pc Solving for the load current IO in order to operate within the acceptable loss, Io≦ It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design. Calculation Example Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V Io≦ θja=96.2℃/W → -10.4mW/℃ Io≦440mA (Icca : 2mA) 25℃=1300mW → 85℃=676mW Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Icca+Ishort) *Ishort : Short circuit current ※ With BD00KA5WFP/WF,R1and R2 are connected outside the IC between ADJ and GND and between OUT and ADJ. Vcc CTL Vcc Vcc Vcc OUT ADJ R1 R2 31.25kΩ 2kΩ 25kΩ (BD00KA5WFP/WF) Fig.18 Fig.19 Pd – Vcc×Icca Vcc-Vo 0.676-2.5×Icca 2.5-1.0 BA10KA5WFP(TO252-5 packaging) 0.0 0.4 0.8 1.2 1.6 2.0 0 25 50 75 100 125 150 Ambient temperature:Ta(℃) 0.0 0.4 0.8 1.2 1.6 2.0 0 25 50 75 100 125 150 周囲温度:Ta(℃) 0 200 400 600 800 1000 0 25 50 75 100 125 150 周囲温度:Ta(℃) 1.30 1.20 687.6mW 562.6mW (1) (2) Rohm standard board mounting Board size:70×70×1.6mm Copper foil area:7×7mm 2 θ ja=96.2(℃/W) Rohm standard board mounting Board size:70×70×1.6mm Copper foil area:7×7mm 2 θ ja=104.2(℃/W) TO252-5 TO252-3 SOP8 Fig.22 Power Dissipation heat reducing characteristics (1)When using a standard board: θ j-c=181.8(℃/W) (2) When using an IC alone θ j-a=222.2(℃/W) Fig.21 Power Dissipation heat reducing characteristics Fig.20 Power Dissipation heat reducing characteristics Ambient temperature:Ta(℃) Ambient temperature:Ta(℃) Vcc: Vo: Io: Icca: Input voltage Output voltage Load current Circuit current |
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