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QXX15LTH Scheda tecnica(PDF) 6 Page - Littelfuse |
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QXX15LTH Scheda tecnica(HTML) 6 Page - Littelfuse |
6 / 8 page 160 Revised: November 1, 2010 05:04 PM ©2010 Littelfuse, Inc Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 4 / 6 / 8 / 10 / 15 Amp Quadracs QxxxxLTx Series Soldering Parameters Reflow Condition Pb – Free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (min to max) (t s) 60 – 180 secs Average ramp up rate (LiquidusTemp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 260°C +0/-5 Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 280°C Environmental Specifications Test Specifications and Conditions High Temperature Voltage Blocking MIL-STD-750: Method 1040, Condition A Rated V DRM (VAC-peak), 125°C, 1008 hours Temperature Cycling MIL-STD-750: Method 1051 -40°C to 150°C, 15-minute dwell, 100 cycles Biased Temperature & Humidity EIA/JEDEC: JESD22-A101 320VDC, 85°C, 85%RH, 1008 hours High Temp Storage MIL-STD-750: Method 1031 150°C, 1008 hours Low-Temp Storage -40°C, 1008 hours Thermal Shock MIL-STD-750: Method 1056 0°C to 100°C, 5-minute dwell, 10-second transfer, 10 cycles Autoclave (Pressure Cooker Test) EIA/JEDEC: JESD22-A102 121°C, 100%RH, 2atm, 168 hours Resistance to Solder Heat MIL-STD-750: Method 2031 260°C, 10 seconds Solderability ANSI/J-STD-002, Category 3, Test A Lead Bend MIL-STD-750: Method 2036, Condition E Physical Specifications Terminal Finish 1005 Matte Tin-plated Body Material UL Recognized epoxy meeting flammability classification 94v-0 Lead Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Good design practice should limit the maximum continuous current through the main terminals to 75% of the device rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do |
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