Solder Profile and Pattern

1) Dip Types (LA, LB ,LAP,LBP series)

Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as

is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the

internal temperature of the LED numeric display does not exceed 100

2) Surface Mount Type (LF-301 series)

Please refer to the following reflow soldering profile and pattern examples for surface mount units.

φ1.5

land shape

+0.1

0

φ0.8

hole shape

LA-301 series

Solder Pattern Example

+0.1

0

φ2.0

land shape

+0.1

0

φ1.0

hole shape

Other series

+0.1

0

300

250

200

150

100

50

0

60

80

100

120

140

40

Time (s)

Soldering Example

Conditions

General

flow conditions

3s or less

260

20

0

A single wave is better than a double wave, while

stationary flow method is the best.

After soldering, immediately lower

the temperature of the substrate

10-0.6

P=1.27

Solder Pattern Example

250

200

150

100

50

0

200

250

300

150

Time (s)

Type

LF-301A/K series

A (Heat Slope 1)

4

B (Preheat)

140 to 160

°C

(1 min. or less)

C (Heat Slope 2)

4

D (Peak temperature, peak time)

250

E (200

50s max.

100

0

50

Reflow Soldering Example

B: Preheat

D: Peak Temperature

E: 200

°C

+ range

A: Heat Slope 1

C: Heat Slope 2

Preheat 30s

or less

LF-301 A/K series

Item

Conditions

Solder Temperature

Process Duration

Solder dip

Solder iron

Reflow

Reflow cannot be used. (other than the LF-301 series)

At least 2mm from the base of the lead pin.

Preheat temperature must

be no greater than 80

No more than 260

30 seconds or less

3 seconds or less

At least 2mm from the base of the lead pin.

Power: No more than 30W.

No more than 300

3 seconds or less