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LF-301 Scheda tecnica(PDF) 1 Page - Rohm |
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LF-301 Scheda tecnica(HTML) 1 Page - Rohm |
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1 / 1 page Solder Profile and Pattern 1) Dip Types (LA, LB ,LAP,LBP series) Please keep the preheat and peak temperatures with dip units as low as possible and the times as short as is feasible, since the products are susceptible to heat during flow soldering. As a guide, ensure that the internal temperature of the LED numeric display does not exceed 100 °C. 2) Surface Mount Type (LF-301 series) Please refer to the following reflow soldering profile and pattern examples for surface mount units. φ1.5 land shape +0.1 0 φ0.8 hole shape LA-301 series Solder Pattern Example +0.1 0 φ2.0 land shape +0.1 0 φ1.0 hole shape Other series +0.1 0 300 250 200 150 100 50 0 60 80 100 120 140 40 Time (s) Soldering Example Conditions General flow conditions 3s or less 260 °C or less 20 0 A single wave is better than a double wave, while stationary flow method is the best. After soldering, immediately lower the temperature of the substrate 10-0.6 P=1.27 Solder Pattern Example 250 200 150 100 50 0 200 250 300 150 Time (s) Type LF-301A/K series A (Heat Slope 1) 4 °C/s max B (Preheat) 140 to 160 °C (1 min. or less) C (Heat Slope 2) 4 °C/s max. D (Peak temperature, peak time) 250 °C max,5s max. E (200 °C + range) 50s max. 100 0 50 Reflow Soldering Example B: Preheat D: Peak Temperature E: 200 °C + range A: Heat Slope 1 C: Heat Slope 2 Preheat 30s or less LF-301 A/K series ∗Please use a resin-based flux,since flux that is acidic or highly alkaline could cause corrosion. Item Conditions Solder Temperature Process Duration Solder dip Solder iron Reflow Reflow cannot be used. (other than the LF-301 series) At least 2mm from the base of the lead pin. Preheat temperature must be no greater than 80 °C. No more than 260 °C. 30 seconds or less 3 seconds or less At least 2mm from the base of the lead pin. Power: No more than 30W. No more than 300 °C. 3 seconds or less |
Codice articolo simile - LF-301 |
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Descrizione simile - LF-301 |
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