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LA112B-YX-PF Scheda tecnica(PDF) 5 Page - LIGITEK electronics co., ltd. |
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LA112B-YX-PF Scheda tecnica(HTML) 5 Page - LIGITEK electronics co., ltd. |
5 / 6 page PART NO. LA112B/YX-PF Time(sec) 2 ° /sec max 25° Preheat 0 0° 50 100 120° 5 °/sec max 150 2.Wave Soldering Profile Dip Soldering Preheat: 120 °C Max Preheat time: 60seconds Max Ramp-up 2 °C/sec(max) Ramp-Down:-5 °C/sec(max) Solder Bath:260 °C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to case) Temp( °C) 260° 260 °C3sec Max Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 60 Seconds Max |
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