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SI-3011ZD Scheda tecnica(PDF) 2 Page - Sanken electric |
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SI-3011ZD Scheda tecnica(HTML) 2 Page - Sanken electric |
2 / 2 page 27 ICs SI-3000ZD Series ■External Dimensions (TO263-5) (Unit : mm) Pin Assignment q VC w VIN e GND (Common to the rear side of product) r VO t Sense (ADJ for SI-3011ZD) Plastic Mold Package Type Flammability: UL94V-0 Product Mass: Approx. 1.48g 9.9 ±0.2 (15 °) (0.5) 2-R0.3 0.1 10.0 ±0.02 3-R0.3 (2 ×R0.45) (R0.3) (R0.3) 0.88 ±0.10 1.5 Dp: ±0.2 φ (1.7 ±0.25 ) 12345 (1.7 ±0.25 ) (1.7 ±0.25 ) (1.7 ±0.25 ) 0.8 ±0.1 0.8 ±0.1 4.5 ±0.2 1.3 0.10 ±0.15 2.4 ±0.2 +0.10 –0.05 10.0 ±0.2 (4.4) (8.0) (3 °) (3 °) (3 °) (3 °) (3 °) 0~6 ° Case temperature measurement point ■Block Diagram CIN: Input capacitor (Approx. 10 µF) CO: Output capacitor (47 µF or larger) The output voltage may oscillate if a low ESR type capacitor (such as a ceramic capacitor) is used for the output capacitor in the SI-3000ZD Series. R1, R2: Output voltage setting resistors The output voltage can be set by connecting R1 and R2 as shown at left. The recommended value for R2 is 10k Ω or 11kΩ. R1= (VO–VADJ) / (VADJ/R2) *: Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended value for R3 is 10k Ω. SI-3011ZD SI-3033ZD REF TSD Drive VIN CIN VC ON/ OFF VO CO R1 R2 ADJ GND 4 - + - + + * R3 2 5 3 1 OCP AMP1 REF TSD Drive VIN CIN ON/ OFF VO SENSE CO GND 4 - + - + + 2 5 3 1 OCP AMP1 VC ■Reference Data Copper Laminate Area (on Glass-Epoxy Board) vs. Thermal Resistance (from Junction to Ambient Temperature) (Typical Value) 55 50 45 40 35 30 0 200 400 600 800 1000 Copper Laminate Area (mm2) 1200 1400 1600 1800 When Using Glass-Epoxy Board of 40 × 40 mm •A higher heat radiation effect can be achieved by enlarging the copper laminate area connected to the inner frame to which a monolithic IC is mounted. •Obtaining the junction temperature Measure GND terminal temperature TC with a thermocouple, etc. Then substitute this value in the following formula to obtain the junction temperature. Tj=PD× θj–C+TC PD= (VIN–VO)•IOUT |
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