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TPA3110D2 Scheda tecnica(PDF) 2 Page - Texas Instruments

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Il numero della parte TPA3110D2
Spiegazioni elettronici  15-W FILTER-FREE STEREO CLASS-D AUDIO POWER AMPLIFIER with SPEAKERGUARD?
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

TPA3110D2 Scheda tecnica(HTML) 2 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
RECOMMENDED OPERATING CONDITIONS
TPA3110D2
SLOS528 – JULY 2009....................................................................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
VCC
Supply voltage
AVCC, PVCC
–0.3 V to 30 V
SD, GAIN0, GAIN1, PBTL, FAULT
–0.3 V to VCC + 0.3 V
VI
Interface pin voltage
PLIMIT
–0.3 V to GVDD + 0.3 V
RINN, RINP, LINN, LINP
–0.3 V to 6.3 V
Continuous total power dissipation
See Dissipation Rating Table
TA
Operating free-air temperature range
–40°C to 85°C
TJ
Operating junction temperature range(2)
–40°C to 150°C
Tstg
Storage temperature range
–65°C to 150°C
BTL: PVCC > 15 V
4.8
RL
Minimum Load Resistance
BTL: PVCC
≤ 15 V
3.2
PBTL
3.2
Human body model (3) (all pins)
±2 kV
ESD
Electrostatic discharge
Charged-device model (4) (all pins)
±500 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The TPA3110D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected
to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection
shutdown. See TI Technical Briefs SLMA002 for more information about using the TSSOP thermal pad.
(3)
In accordance with JEDEC Standard 22, Test Method A114-B.
(4)
In accordance with JEDEC Standard 22, Test Method C101-A
PACKAGE(1)
TA ≤ 25°C
DERATING FACTOR (
θ
JA)
TA = 85°C
θ
JP
ΨJT
28 pin TSSOP (PWP)
4.48 W
27.87 °C/W
2.33 W
0.72 °C/W
0.45 °C/W
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
VCC
Supply voltage
PVCC, AVCC
8
26
V
VIH
High-level input voltage
SD, GAIN0, GAIN1, PBTL
2
V
VIL
Low-level input voltage
SD, GAIN0, GAIN1, PBTL
0.8
V
VOL
Low-level output voltage
FAULT, RPULL-UP=100k, VCC=26V
0.8
V
IIH
High-level input current
SD, GAIN0, GAIN1, PBTL, VI = 2V, VCC = 18 V
50
µA
IIL
Low-level input current
SD, GAIN0, GAIN1, PBTL, VI = 0.8 V, VCC = 18 V
5
µA
TA
Operating free-air temperature
–40
85
°C
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s) :TPA3110D2


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