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TL082IP Scheda tecnica(PDF) 6 Page - Texas Instruments |
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TL082IP Scheda tecnica(HTML) 6 Page - Texas Instruments |
6 / 29 page TL081, TL081A, TL081B, TL082, TL082A, TL082B TL082Y, TL084, TL084A, TL084B, TL084Y JFET-INPUT OPERATIONAL AMPLIFIERS SLOS081E – FEBRUARY 1977 – REVISED FEBRUARY 1999 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL084Y chip information These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – 1OUT 1IN + 1IN – VCC+ (4) (6) (3) (2) (5) (1) – + (7) 2IN + 2IN – 2OUT (11) VCC – + – 3OUT 3IN + 3IN – (13) (10) (9) (12) (8) – + (14) 4OUT 4IN + 4IN – 105 62 (13) (12) (11) (10) (9) (8) (7) (6) (4) (3) (2) (1) (14) |
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