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TL054ID Scheda tecnica(PDF) 1 Page - Texas Instruments

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Il numero della parte TL054ID
Spiegazioni elettronici  ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
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TL054ID Scheda tecnica(HTML) 1 Page - Texas Instruments

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TL05x, TL05xA, TL05xY
ENHANCED-JFET LOW-OFFSET
OPERATIONAL AMPLIFIERS
SLOS178 – FEBRUARY 1997
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Direct Upgrades to TL07x and TL08x BiFET
Operational Amplifiers
D Faster Slew Rate (20 V/µs Typ) Without
Increased Power Consumption
D On-Chip Offset Voltage Trimming for
Improved DC Performance and Precision
Grades Are Available (1.5 mV, TL051A)
D Available in TSSOP for Small Form-Factor
Designs
description
The TL05x series of JFET-input operational amplifiers offers improved dc and ac characteristics over the TL07x
and TL08x families of BiFET operational amplifiers. On-chip zener trimming of offset voltage yields precision
grades as low as 1.5 mV (TL051A) for greater accuracy in dc-coupled applications. Texas Instruments improved
BiFET process and optimized designs also yield improved bandwidth and slew rate without increased power
consumption. The TL05x devices are pin-compatible with the TL07x and TL08x and can be used to upgrade
existing circuits or for optimal performance in new designs.
BiFET operational amplifiers offer the inherently higher input impedance of the JFET-input transistors, without
sacrificing the output drive associated with bipolar amplifiers. This makes them better suited for interfacing with
high-impedance sensors or very low-level ac signals. They also feature inherently better ac response than
bipolar or CMOS devices having comparable power consumption.
The TL05x family was designed to offer higher precision and better ac response than the TL08x with the low
noise floor of the TL07x. Designers requiring significantly faster ac response or ensured lower noise should
consider the Excalibur TLE208x and TLE207x families of BiFET operational amplifiers.
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25
°C
SMALL
OUTLINE†
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(N)
PLASTIC
DIP
(P)
CHIP
FORM‡
(Y)
800
µV
TL051ACD
TL052ACD
TL051ACP
TL052ACP
TL051Y
0
°C to 70°C
1.5 mV
TL051CD
TL052CD
TL054ACD
TL054ACN
TL051CP
TL052CP
TL051Y
TL052Y
TL054Y
4 mV
TL054CD
TL054CN
800
µV
TL051AID
TL052AID
TL051AIP
TL052AIP
–40
°C to 85°C
1.5 mV
TL051ID
TL052ID
TL054AID
TL054AIN
TL051IP
TL052IP
4 mV
TL054ID
TL054IN
800
µV
TL051AMD
TL052AMD
TL051AMFK
TL052AMFK
TL051AMJG
TL052AMJG
TL051AMP
TL052AMP
–55
°C to 125°C
1.5 mV
TL051MD
TL052MD
TL054AMD
TL051MFK
TL052MFK
TL054AMFK
TL054AMJ
TL051MJG
TL052MJG
TL054AMN
TL051MP
TL052MP
4 mV
TL054MD
TL054MFK
TL054MJ
TL054MN
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TL054CDR).
‡ Chip forms are tested at 25
°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
© 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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