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CD4000 Scheda tecnica(PDF) 6 Page - Texas Instruments

Il numero della parte CD4000
Spiegazioni elettronici  CMOS DUAL UP-COUNTERS
Download  13 Pages
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Produttore elettronici  TI [Texas Instruments]
Homepage  http://www.ti.com
Logo TI - Texas Instruments

CD4000 Scheda tecnica(HTML) 6 Page - Texas Instruments

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
7702301EA
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4518BE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4518BF
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4518BF3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4518BM
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4518BM96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4518BNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4518BPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4518BPWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4520BE
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4520BF
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4520BF3A
ACTIVE
CDIP
J
16
1
None
Call TI
Level-NC-NC-NC
CD4520BM
ACTIVE
SOIC
D
16
40
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4520BM96
ACTIVE
SOIC
D
16
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4520BNSR
ACTIVE
SO
NS
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4520BPW
ACTIVE
TSSOP
PW
16
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4520BPWR
ACTIVE
TSSOP
PW
16
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Addendum-Page 1


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