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HCPL4503SM Scheda tecnica(PDF) 9 Page - Fairchild Semiconductor |
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HCPL4503SM Scheda tecnica(HTML) 9 Page - Fairchild Semiconductor |
9 / 10 page ©2005 Fairchild Semiconductor Corporation www.fairchildsemi.com HCPL4503M Rev. 1.0.3 9 Carrier Tape Specifications Reflow Profile Symbol Description Dimension in mm WTape Width 16.0 ± 0.3 tTape Thickness 0.30 ± 0.05 P0 Sprocket Hole Pitch 4.0 ± 0.1 D0 Sprocket Hole Diameter 1.55 ± 0.05 E Sprocket Hole Location 1.75 ± 0.10 FPocket Location 7.5 ± 0.1 P2 4.0 ± 0.1 PPocket Pitch 12.0 ± 0.1 A0 Pocket Dimensions 10.30 ±0.20 B0 10.30 ±0.20 K0 4.90 ±0.20 W1 Cover Tape Width 1.6 ± 0.1 dCover Tape Thickness 0.1 max Max. Component Rotation or Tilt 10° R Min. Bending Radius 30 d 0 P t 2 D0 1 1 W User Direction of Feed 0 K B0 A0 W E D F P P • Peak reflow temperature: 260 C (package surface temperature) • Time of temperature higher than 183 C for 160 seconds or less • One time soldering reflow is recommended 245 C, 10–30 s Time (Minute) 0 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Time above 183C, <160 sec Ramp up = 2–10C/sec 260 C peak |
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