UC1697v
128x128RGB CSTN Controller-Driver
Revision A_0.6
7
Name
Type
# of Pads
Description
HIGH VOLTAGE LCD DRIVER OUTPUT
SEG1 ~
SEG384
HV
384
SEG (column) driver outputs. Support up to 128xRGB pixels.
Leave unused SEG drivers open-circuit.
COM1 ~
COM128
HV
128
COM (row) driver outputs. Support up to 128 rows.
When designing LCM, always start from COM1. If the LCM has N
pixel rows and N is less than 128, set CEN to be N-1, and leave COM
drivers [N+1 ~ 128] open-circuit.
MISC. PINS
VDDX
O
5
Auxiliary VDD. These pins are connected to the main VDD bus within
the IC. These pads are provided to facilitate chip configurations in
COG application.
These pins should NOT be used to provide VDD power to the chip. It is
not necessary to connect VDDX to main VDD externally.
TST4
I/HV
2
Test control. This pin has on-chip pull-up resistor. Leave it open
during normal operation.
TST4 is also used as one of the high voltage power supply for MTP
programming operation. For COG designs, please wire out TST4 with
trace resistance between 30~50
Ω.
TST1
TST2
O
1
1
Test I/O pins. Leave these pins open during normal use.
NOTE:
Several control registers will specify “0 based index” for COM and SEG electrodes. In those situations,
COMX or SEGX will correspond to index X-1, and the value ranges for those index registers will be 0~127
for COM and 0~383 for SEG.