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ISL55110_0712 Scheda tecnica(PDF) 3 Page - Intersil Corporation |
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ISL55110_0712 Scheda tecnica(HTML) 3 Page - Intersil Corporation |
3 / 15 page 3 FN6228.2 December 12, 2007 Absolute Maximum Ratings (TA = +25°C) Thermal Information VH+ to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.0V VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.5V VIN_A, VIN_V, PDN, ENABLE. . . . . . (GND - 0.5V) to (VDD + 0.5V) OA, OB. . . . . . . . . . . . . . . . . . . . . . . . . . .(GND - 0.5) to (VH + 0.5V) Maximum Peak Output Current . . . . . . . . . . . . . . . . . . . . . . (300mA) ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C Thermal Resistance θJA (°C/W) θJC (°C/W) 16 Ld (4x4) QFN Package (Notes 2, 3) 45 3.0 8 Ld TSSOP Package (Note 1) . . . . . . 140 N/A Maximum Junction Temperature (Plastic Package). . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA NOTES: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 2. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 3. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Recommended Operating Conditions PARAMETER DESCRIPTION CONDITIONS MIN (Note 4) TYP MAX (Note 4) UNIT VH Driver Supply Voltage 5 12 13.2 V VDD Logic Supply Voltage 2.7 5.5 V TA Ambient Temperature -40 +85 °C TJ Junction Temperature +150 °C DC Electrical Specifications VH = +12V, VDD = 2.7V to 5.5V, TA = +25°C, unless otherwise specified. PARAMETER DESCRIPTION TEST CONDITIONS MIN (Note 4) TYP MAX (Note 4) UNITS LOGIC CHARACTERISTICS VIX_LH Logic Input Threshold - Low to High lIH = 1µA: VIN_A, VIN_B 1.32 1.42 1.52 V VIX_HL Logic Input Threshold - High to Low lIL = 1µA: VIN_A, VIN_B 1.12 1.22 1.32 V VHYS Logic Input Hysteresis VIN_A,VIN_B 0.2 V VIH Logic Input High Threshold PDN 2.0 VDD V VIL Logic Input Low Threshold PDN 0 0.8 V VIH Logic Input High Threshold ENABLE - QFN only 2.0 VDD V VIL Logic Input Low Threshold ENABLE - QFN only 0 0.8 V IIX_H Input Current Logic High VIN_A,VIN_B = VDD 10 20 nA IIX_L Input Current Logic Low VIN_A, VIN_B = 0V 10 20 nA II_H Input Current Logic High PDN = VDD 10 20 nA II_L Input Current Logic Low PDN = 0V 10 15 nA II_H Input Current Logic High ENABLE = VDD (QFN only) 12 mA II_L Input Current Logic Low ENABLE = 0V (QFN only) -25 nA ISL55110, ISL55111 |
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