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MLX90807LUF Scheda tecnica(PDF) 4 Page - Melexis Microelectronic Systems |
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MLX90807LUF Scheda tecnica(HTML) 4 Page - Melexis Microelectronic Systems |
4 / 8 page MLX90807 Relative Integrated Pressure Sensor 3901090807 Page 4 of 8 Data Sheet Rev 003 Feb 08 5 Diagnostic features DC Operating Parameters TA = -40 oC to 140oC, V DD = 5 V (unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Units Output when sensor is broken Sensor broken 2 % Vdd Output when Vdd is broken Pull up > 4k7 4 % Vdd Output when Vdd is broken Pull down 0 % Vdd Output when Vss is broken Pull down > 10k 96 % Vdd Output when Vss is broken Pull up 100 % Vdd Table 3: Diagnostic features 6 Detailed General Description This chip integrates a pressure sensor and the associated signal conditioning on the same die. The supply voltage VDD directly supplies the pressure sensor. The pressure sensing element consists of a square diaphragm realized in the silicon chip by backside etching. Due to its small thickness this diaphragm reacts to a pressure difference at both of its side by cambering. The internal strain increases, in particular at the border of the diaphragm. Here, the piezo- resistive elements have been implanted into the silicon diaphragm, which act as transducer. The piezo-resistive elements react to pressure induced changes of strain by changes in their resistance. Four resistors are placed at all four borders of the square diaphragm. They are arranged in a Wheatstone-bridge. A chopped instrumentation stage amplifies the differential output signal of the sensor. The gain of this amplifier can be adjusted with 3 bits. After the input stage, there is a 3 bit programmable coarse offset which is followed by a differential to single-ended conversion. The reference voltage for this stage is generated by a 10 bit DAC and varies linearly with temperature in order to perform the offset and offset drift compensation. A digital hardware multiplier calculates this compensation. The temperature signal, serving as input for this multiplier, is generated from the ADC of the output signal of the internal temperature sensor. The chopped signal is demodulated with a switched capacitor stage. The buffered output serves as reference for a 10 bit DAC to perform the span and span drift compensation. The DAC is controlled by the digital part. Finally the signal is given out by a class AB rail-to-rail amplifier capable of sourcing and sinking large currents. A 3-point temperature and 2-point pressure calibration is required (room temperature, a low temperature and a high temperature), to achieve an error less than ±1% over the complete pressure and temperature range (the output error is referred to the output span). PTC (Programming Through Connector) protocol is used to perform calibration. The programming of the sensor chip is carried out via the analog connections (i.e. supply, ground, signal out). No additional pins are necessary for calibration. The output circuit is protected against short circuit to GND, Vbat (16V) and Vdd. |
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