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FDG8850NZ Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor

Il numero della parte FDG8850NZ
Spiegazioni elettronici  Dual N-Channel PowerTrench짰 MOSFET
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Produttore elettronici  FAIRCHILD [Fairchild Semiconductor]
Homepage  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FDG8850NZ Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor

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©2007 Fairchild Semiconductor Corporation
FDG8850NZ Rev.B
Electrical Characteristics T
J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 250μA, VGS = 0V
30
V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
ID = 250μA, referenced to 25°C
25
mV/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 24V, VGS = 0V
1
μA
IGSS
Gate to Source Leakage Current
VGS = ±12V, VDS= 0V
±10
μA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 250μA
0.65
1.0
1.5
V
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = 250μA, referenced to 25°C
–3.0
mV/°C
rDS(on)
Static Drain to Source On Resistance
VGS = 4.5V, ID = 0.75A
VGS = 2.7V, ID = 0.67A
VGS = 4.5V, ID = 0.75A ,TJ = 125°C
0.25
0.29
0.36
0.4
0.5
0.6
Ω
gFS
Forward Transconductance
VDS = 5V, ID = 0.75A
3
S
Dynamic Characteristics
Ciss
Input Capacitance
VDS = 10V, VGS = 0V, f= 1MHZ
90
120
pF
Coss
Output Capacitance
20
30
pF
Crss
Reverse Transfer Capacitance
15
25
pF
Switching Characteristics
td(on)
Turn-On Delay Time
VDD = 5V, ID = 0.5A,
VGS = 4.5V,RGEN = 6Ω
4
10
ns
tr
Rise Time
1
10
ns
td(off)
Turn-Off Delay Time
9
18
ns
tf
Fall Time
1
10
ns
Qg
Total Gate Charge
VGS =4.5V, VDD = 5V, ID = 0.75A
1.03
1.44
nC
Qgs
Gate to Source Charge
0.29
nC
Qgd
Gate to Drain “Miller” Charge
0.17
nC
(note 2)
Drain-Source Diode Characteristics
IS
Maximum Continuous Drain-Source Diode Forward Current
0.3
A
VSD
Source to Drain Diode Forward Voltage
VGS = 0V, IS = 0.3A
(Note 2)
0.76
1.2
V
and Maximum Ratings
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
RθJC is guaranteed by design while RθJA is determined by the user's board design.
2. Pulse Test: Pulse Width < 300
μs, Duty cycle < 2.0%.
a. 350°C/W when mounted on a
1 in2 pad of 2 oz copper .
b. 415°C/W when mounted on a minimum pad
of 2 oz copper.
Scale 1:1 on letter size paper.


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