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FDG8850NZ Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDG8850NZ Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page www.fairchildsemi.com 2 ©2007 Fairchild Semiconductor Corporation FDG8850NZ Rev.B Electrical Characteristics T J = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage ID = 250μA, VGS = 0V 30 V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 250μA, referenced to 25°C 25 mV/°C IDSS Zero Gate Voltage Drain Current VDS = 24V, VGS = 0V 1 μA IGSS Gate to Source Leakage Current VGS = ±12V, VDS= 0V ±10 μA On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250μA 0.65 1.0 1.5 V ΔVGS(th) ΔTJ Gate to Source Threshold Voltage Temperature Coefficient ID = 250μA, referenced to 25°C –3.0 mV/°C rDS(on) Static Drain to Source On Resistance VGS = 4.5V, ID = 0.75A VGS = 2.7V, ID = 0.67A VGS = 4.5V, ID = 0.75A ,TJ = 125°C 0.25 0.29 0.36 0.4 0.5 0.6 Ω gFS Forward Transconductance VDS = 5V, ID = 0.75A 3 S Dynamic Characteristics Ciss Input Capacitance VDS = 10V, VGS = 0V, f= 1MHZ 90 120 pF Coss Output Capacitance 20 30 pF Crss Reverse Transfer Capacitance 15 25 pF Switching Characteristics td(on) Turn-On Delay Time VDD = 5V, ID = 0.5A, VGS = 4.5V,RGEN = 6Ω 4 10 ns tr Rise Time 1 10 ns td(off) Turn-Off Delay Time 9 18 ns tf Fall Time 1 10 ns Qg Total Gate Charge VGS =4.5V, VDD = 5V, ID = 0.75A 1.03 1.44 nC Qgs Gate to Source Charge 0.29 nC Qgd Gate to Drain “Miller” Charge 0.17 nC (note 2) Drain-Source Diode Characteristics IS Maximum Continuous Drain-Source Diode Forward Current 0.3 A VSD Source to Drain Diode Forward Voltage VGS = 0V, IS = 0.3A (Note 2) 0.76 1.2 V and Maximum Ratings Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθJA is determined by the user's board design. 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. a. 350°C/W when mounted on a 1 in2 pad of 2 oz copper . b. 415°C/W when mounted on a minimum pad of 2 oz copper. Scale 1:1 on letter size paper. |
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