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TPA6043A4RHB Scheda tecnica(PDF) 4 Page - Texas Instruments |
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TPA6043A4RHB Scheda tecnica(HTML) 4 Page - Texas Instruments |
4 / 30 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS RECOMMENDED OPERATING CONDITIONS TPA6043A4 SLOS543 – AUGUST 2007 TERMINAL FUNCTIONS (continued) TERMINAL I/O/P DESCRIPTION NAME NO. ROUT+ 20 O Right-channel positive audio output HP_EN 22 I Headphone channel enable logic input; active high enable. HIGH=ENABLE. SPKR_EN 23 I Speaker channel enable logic input; active low enable. LOW=ENABLE. BYPASS 24 P Common-mode bias voltage for speaker preamplifiers REG_EN 25 I Enable pin (Active HIGH) for turning on/off LDO. HIGH=ENABLE HP_INR 26 I Headphone right-channel audio input HP_INL 27 I Headphone left-channel audio input SGND 28 P Signal ground, connect to CPGND and SPGND REG_OUT 29 O Regulated 3.3-V output VDD 30 P Positive power supply GAIN0 31 I Bit 0, MSB, of gain select bits GAIN1 32 I Bit 1, LSB, of gain select bits Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is required for Thermal Pad Die Pad P mechanical stability and will enhance thermal performance. over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Supply voltage HPVDD, VDD, SPVDD, CPVDD –0.3 to 6 V SPKR_LIN+, SPKR_LIN-, SPKR_RIN+, SPKR_RIN-, –0.3 to 6.3 HP_EN,GAIN0, GAIN1, SPK_EN, REG_EN VI Input voltage V HP_INL, HP_INR HP Enabled –3.5 to 3.5 HP_INL, HP_INR HP not Enabled –0.3 to 3.5 Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 150 °C Tstg Storage temperature range –65 to 150 °C Electrostatic discharge HBM for HP_OUTL and HP_OUTR 8 kV CDM 500 V Electrostatic discharge, all other pins HBM 2 kV (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE(1) TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C RHB 5.06 W 40 mW/ °C 4.04 W 3.23 W (1) The PowerPAD™ must be soldered to a thermal land on the printed-circuit board. See the Texas Instruments document, PowerPAD™ Thermally Enhanced Package application report (literature number SLMA002) for more information regarding the PowerPAD™ package. MIN MAX UNIT Supply voltage VDD, SPVDD 4.5 5.5 V Supply voltage HPVDD, CPVDD 3 5.5 V VIH High-level input voltage SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN 2 V VIL Low-level input voltage SPKR_EN, HP_EN, GAIN0, GAIN1, REG_EN 0.8 V 4 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Link(s): TPA6043A4 |
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