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FDN340P Scheda tecnica(PDF) 2 Page - Fairchild Semiconductor |
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FDN340P Scheda tecnica(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDN340P Rev E1 Electrical Characteristics T A =25° C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ∆TJ Breakdown Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C –12 mV/ °C VDS = –16 V, VGS = 0 V –1 µA IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V,TJ=55 °C –10 IGSSF Gate–Body Leakage, Forward VGS = 8 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –8 V, VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.8 –1.5 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C 3 mV/ °C VGS = –4.5 V, ID = –2 A 60 70 m Ω VGS = –4.5 V, ID = –2 A,TJ=125 °C 77 120 RDS(on) Static Drain–Source On–Resistance VGS= –2.5 V, ID = –1.7A, 82 110 ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –5 A gFS Forward Transconductance VDS = –4.5 V, ID = –2 A 9 S Dynamic Characteristics 600 Input Capacitance 779 pF 175 Output Capacitance 121 pF 80 Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 56 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 10 20 ns tr Turn–On Rise Time 9 10 ns td(off) Turn–Off Delay Time 27 43 ns tf Turn–Off Fall Time VDD = –10 V, ID = –1 A, VGS = –4.5 V, RGEN = 6 Ω 11 20 ns Qg Total Gate Charge 7.2 10 nC Qgs Gate–Source Charge 1.7 nC Qgd Gate–Drain Charge VDS = –10V, ID = –3.5 A, VGS = –4.5 V 1.5 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –0.42 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –0.42 A (Note 2) –0.7 –1.2 V Notes: 1. RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJCis guaranteed by design while RθCAis determined by the user's board design. a. 250°C/W when mounted on a 0.02in 2 pad of 2 oz copper b. 270°C/W when mounted on a .001 in 2 pad of 2 oz copper Scale 1 : 1 on letter size paper 2.Pulse Test: Pulse Width <300 µs, Duty Cycle <2.0% |
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