MC14513B

http://onsemi.com

10

PACKAGE DIMENSIONS

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 mm (0.010) AT MAXIMUM

MATERIAL CONDITION, IN RELATION TO SEATING

PLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

4. CONTROLLING DIMENSION: INCH.

1

SEATING

PLANE

10

9

18

M

A

B

K

C

N

F

G

D

H

J

L

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

22.22

23.24

0.875

0.915

B

6.10

6.60

0.240

0.260

C

3.56

4.57

0.140

0.180

D

0.36

0.56

0.014

0.022

F

1.27

1.78

0.050

0.070

G

2.54 BSC

0.100 BSC

H

1.02

1.52

0.040

0.060

J

0.20

0.30

0.008

0.012

K

2.92

3.43

0.115

0.135

L

7.62 BSC

0.300 BSC

M

0

15

0

15

N

0.51

1.02

0.020

0.040

__

_

_

PDIP−18

CASE 707−02

ISSUE D

ON Semiconductor and

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