MC100LVEL11

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2

Table 1. PIN DESCRIPTION

Pin

Function

Q0, Q0; Q1, Q1

ECL Data Outputs

D, D

ECL Data Inputs

Positive Supply

Negative Supply

EP

Exposed pad must be connected to a sufficient thermal

conduit. Electrically connect to the most negative supply

or leave floating open.

Table 2. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

75 kW

Internal Input Pullup Resistor

75 kW

ESD Protection

Human Body Model

Machine Model

Charge Device Model

> 4 KV

> 400 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

63

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

PECL Mode Power Supply

8 to 0

V

NECL Mode Power Supply

−8 to 0

V

PECL Mode Input Voltage

NECL Mode Input Voltage

6 to 0

−6 to 0

V

Output Current

Continuous

Surge

50

100

mA

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

0 lpfm

500 lpfm

SOIC−8

SOIC−8

190

130

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

SOIC−8

41 to 44 ± 5%

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lpfm

500 lpfm

TSSOP−8

TSSOP−8

185

140

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

41 to 44 ± 5%

°C/W

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

DFN8

DFN8

129

84

°C/W

°C/W

Wave Solder

Pb

Pb−Free

<2 to 3 sec @ 248°C

<2 to 3 sec @ 260°C

265

265

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.