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TL1431ID Scheda tecnica(PDF) 9 Page - STMicroelectronics |
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TL1431ID Scheda tecnica(HTML) 9 Page - STMicroelectronics |
9 / 13 page TL1431 Package Mechanical Data 9/13 4 Package Mechanical Data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4.1 SO-8 Batwing Package DIM. mm. inch MIN. TYP MAX. MIN. TYP. MAX. A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.04 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 e 1.27 0.050 H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.40 1.27 0.016 0.050 k ˚ (max.) ddd 0.1 0.04 SO-8 MECHANICAL DATA 0016023/C 8 |
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