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AD5532ABC-1 Scheda tecnica(PDF) 6 Page - Analog Devices |
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AD5532ABC-1 Scheda tecnica(HTML) 6 Page - Analog Devices |
6 / 16 page REV. A –6– AD5533B ORDERING GUIDE Output Output Impedance Voltage Span Package Package Description Function (Typ) (V) Description Option AD5533BBC-1 32-Channel Precision ISHA Only 0.5 Ω 10 74-Lead CSPBGA BC-74 AD5533ABC-1* 32-Channel ISHA Only 0.5 Ω 10 74-Lead CSPBGA BC-74 AD5532ABC-1* 32 DACs, 32-Channel ISHA 0.5 Ω 10 74-Lead CSPBGA BC-74 AD5532ABC-2* 32 DACs, 32-Channel ISHA 0.5 Ω 20 74-Lead CSPBGA BC-74 AD5532ABC-3* 32 DACs, 32-Channel ISHA 500 Ω 10 74-Lead CSPBGA BC-74 AD5532ABC-5* 32 DACs, 32-Channel ISHA 1 k Ω 10 74-Lead CSPBGA BC-74 AD5532BBC-1* 32 DACs, 32-Channel Precision ISHA 0.5 Ω 10 74-Lead CSPBGA BC-74 EVAL-AD5533EB AD5532/AD5533 Evaluation Board *Separate Data Sheet ABSOLUTE MAXIMUM RATINGS 1, 2 (TA = 25 °C, unless otherwise noted.) VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17 V VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17 V AVCC to AGND, DAC_GND . . . . . . . . . . . . . –0.3 V to +7 V DVCC to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Digital Inputs to DGND . . . . . . . . . . –0.3 V to DVCC + 0.3 V Digital Outputs to DGND . . . . . . . . . –0.3 V to DVCC + 0.3 V REF_IN to AGND, DAC_GND . . . . –0.3 V to AVCC + 0.3 V VIN to AGND, DAC_GND . . . . . . . . –0.3 V to AVCC + 0.3 V VOUT0–31 to AGND . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V OFFS_IN to AGND . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V OFFS_OUT to AGND . . . . AGND – 0.3 V to AVCC + 0.3 V AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V Operating Temperature Range Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . 150 °C 74-Lead CSPBGA Package, θ JA Thermal Impedance . . 41 °C/W Reflow Soldering Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 220 °C Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec Max Power Dissipation . . . . . . . . . . . . (150 °C – TA)/θJA mW3 Max Continuous Load Current at TJ = 70 °C, per Channel Group . . . . . . . . . . . . . . . . . . . . . . . 15.5 mA 4 NOTES 1Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operationa l sections of this specification is not implied. Exposure to absolute maximum rating condi- tions for extended periods may affect device reliability. 2Transient currents of up to 100 mA will not cause SCR latch-up. 3This limit includes load power. 4This maximum allowed continuous load current is spread over eight channels, with channels grouped as follows: Group 1: Channels 3, 4, 5, 6, 7, 8, 9, 10 Group 2: Channels 14, 16, 18, 20, 21, 24, 25, 26 Group 3: Channels 15, 17, 19, 22, 23, 27, 28, 29 Group 4: Channels 0, 1, 2, 11, 12, 13, 30, 31 For higher junction temperatures, derate as follows: Max Continuous Load Current TJ ( °C) per Group (mA) 70 15.5 90 9.025 100 6.925 110 5.175 125 3.425 135 2.55 150 1.5 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5533B features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE |
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