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ISL1220 Scheda tecnica(PDF) 3 Page - Intersil Corporation

Il numero della parte ISL1220
Spiegazioni elettronici  I2C짰 Real Time Clock/Calendar with Frequency Output
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Produttore elettronici  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

ISL1220 Scheda tecnica(HTML) 3 Page - Intersil Corporation

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FN6315.0
June 22, 2006
Absolute Maximum Ratings
Thermal Information
Voltage on VDD, VBAT, SCL, SDA, and IRQ, FOUT Pins
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
Voltage on X1 and X2 Pins
(respect to ground) . . . . . . . . . . . . -0.5V to VDD + 0.5 (VDD Mode)
-0.5V to VBAT + 0.5 (VBAT Mode)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . .>2kV
ESD Rating (Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . .>175V
Output Current Sink (FOUT, IRQ . . . . . . . . . . . . . . . . . . . . . . . . 3mA
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . .
120
Moisture Sensitivity (see Technical Brief TB363). . . . . . . . . . Level 2
Maximum Junction Temperature (Plastic Package). . . . . . . . . 150°C
Recommended Operating Conditions
Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
VDD Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
VBAT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
(Note 5)
MAX
UNITS
NOTES
VDD
Main Power Supply
2.7
5.5
V
VBAT
Battery Supply Voltage
1.8
5.5
V
IDD1
Supply Current
VDD = 5V
2
6
µA
2, 3
VDD = 3V
1.2
4
µA
IDD2
Supply Current with I2C Active
VDD = 5V
40
120
µA
2, 3
IDD3
Supply Current (Low Power Mode)
VDD = 5V, LPMODE = 1
1.4
5
µA
2, 7
IBAT
Battery Supply Current
VBAT = 3V
400
950
nA
2
IBATLKG
Battery Input Leakage
VDD = 5.5V, VBAT = 1.8V
100
nA
ILI
Input Leakage Current on SCL
100
nA
ILO
I/O Leakage Current on SDA
100
nA
VTRIP
VBAT Mode Threshold
1.6
2.2
2.64
V
VTRIPHYS
VTRIP Hysteresis
10
35
60
mV
VBATHYS
VBAT Hysteresis
10
50
100
mV
IRQ, FOUT
VOL
Output Low Voltage
VDD = 5V, IOL = 3mA
0.4
V
VDD = 2.7V, IOL = 1mA
0.4
V
ILO
Output Leakage Current
VDD = 5.5V
VOUT = 5.5V
100
400
nA
Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
(Note 5)
MAX
UNITS
NOTES
VDD SR-
VDD Negative Slewrate
10
V/ms
4
Serial Interface Specifications
Over the recommended operating conditions unless otherwise specified.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
(Note 5)
MAX
UNITS
NOTES
SERIAL INTERFACE SPECS
VIL
SDA and SCL Input Buffer LOW
Voltage
-0.3
0.3 x
VDD
V
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