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ISL1220 Scheda tecnica(PDF) 3 Page - Intersil Corporation |
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ISL1220 Scheda tecnica(HTML) 3 Page - Intersil Corporation |
3 / 20 page 3 FN6315.0 June 22, 2006 Absolute Maximum Ratings Thermal Information Voltage on VDD, VBAT, SCL, SDA, and IRQ, FOUT Pins (respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V Voltage on X1 and X2 Pins (respect to ground) . . . . . . . . . . . . -0.5V to VDD + 0.5 (VDD Mode) -0.5V to VBAT + 0.5 (VBAT Mode) Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . .>2kV ESD Rating (Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . .>175V Output Current Sink (FOUT, IRQ . . . . . . . . . . . . . . . . . . . . . . . . 3mA Thermal Resistance (Typical, Note 1) θJA (°C/W) 10 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . 120 Moisture Sensitivity (see Technical Brief TB363). . . . . . . . . . Level 2 Maximum Junction Temperature (Plastic Package). . . . . . . . . 150°C Recommended Operating Conditions Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C VDD Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V VBAT Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8V to 5.5V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN TYP (Note 5) MAX UNITS NOTES VDD Main Power Supply 2.7 5.5 V VBAT Battery Supply Voltage 1.8 5.5 V IDD1 Supply Current VDD = 5V 2 6 µA 2, 3 VDD = 3V 1.2 4 µA IDD2 Supply Current with I2C Active VDD = 5V 40 120 µA 2, 3 IDD3 Supply Current (Low Power Mode) VDD = 5V, LPMODE = 1 1.4 5 µA 2, 7 IBAT Battery Supply Current VBAT = 3V 400 950 nA 2 IBATLKG Battery Input Leakage VDD = 5.5V, VBAT = 1.8V 100 nA ILI Input Leakage Current on SCL 100 nA ILO I/O Leakage Current on SDA 100 nA VTRIP VBAT Mode Threshold 1.6 2.2 2.64 V VTRIPHYS VTRIP Hysteresis 10 35 60 mV VBATHYS VBAT Hysteresis 10 50 100 mV IRQ, FOUT VOL Output Low Voltage VDD = 5V, IOL = 3mA 0.4 V VDD = 2.7V, IOL = 1mA 0.4 V ILO Output Leakage Current VDD = 5.5V VOUT = 5.5V 100 400 nA Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL PARAMETER CONDITIONS MIN TYP (Note 5) MAX UNITS NOTES VDD SR- VDD Negative Slewrate 10 V/ms 4 Serial Interface Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS MIN TYP (Note 5) MAX UNITS NOTES SERIAL INTERFACE SPECS VIL SDA and SCL Input Buffer LOW Voltage -0.3 0.3 x VDD V ISL1220 |
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