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MC13192 Scheda tecnica(PDF) 1 Page - Freescale Semiconductor, Inc |
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MC13192 Scheda tecnica(HTML) 1 Page - Freescale Semiconductor, Inc |
1 / 24 page © Freescale Semiconductor, Inc., 2004, 2005. All rights reserved. Freescale Semiconductor Technical Data Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. Document Number: MC13192 Rev. 2.9, 08/2005 MC13192/MC13193 Package Information Plastic Package Case 1311-03 (QFN-32) (Scale 1:1) Ordering Information Device Device Marking Package MC13192 MC13193 13192 13193 QFN-32 QFN-32 1 Introduction The MC13192 and MC13193 are short range, low power, 2.4 GHz Industrial, Scientific, and Medical (ISM) band transceivers. The MC13192/MC13193 contain a complete 802.15.4 physical layer (PHY) modem designed for the IEEE® 802.15.4 wireless standard which supports peer-to-peer, star, and mesh networking. The MC13192 includes the 802.15.4 PHY/MAC for use with the HCS08 Family of MCUs. The MC13193 also includes the 802.15.4 PHY/MAC plus the ZigBee Protocol Stack for use with the HCS08 Family of MCUs. With the exception of the addition of the ZigBee Protocol Stack, the MC13193 functionality is the same as the MC13192. When combined with an appropriate microcontroller (MCU), the MC13192/MC13193 provide a cost-effective solution for short-range data links and networks. Interface with the MCU is accomplished using a four wire serial peripheral interface (SPI) connection and an interrupt request output which allows for the use of a variety of processors. The software and processor MC13192/MC13193 2.4 GHz Low Power Transceiver for the IEEE® 802.15.4 Standard Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . 3 4 Data Transfer Modes . . . . . . . . . . . . . . . . . . . 3 5 Electrical Characteristics . . . . . . . . . . . . . . . 8 6 Functional Description . . . . . . . . . . . . . . . . 12 7 Pin Connections . . . . . . . . . . . . . . . . . . . . . . 15 8 Applications Information . . . . . . . . . . . . . . . 18 9 Packaging Information . . . . . . . . . . . . . . . . . 23 |
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