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MMDF3N03HD Scheda tecnica(PDF) 5 Page - ON Semiconductor |
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MMDF3N03HD Scheda tecnica(HTML) 5 Page - ON Semiconductor |
5 / 12 page MMDF3N03HD http://onsemi.com 5 t, TIME Figure 7. Reverse Recovery Time (trr) di/dt = 300 A/µs Standard Cell Density High Cell Density tb trr ta trr SAFE OPERATING AREA The Forward Biased Safe Operating Area curves define the maximum simultaneous drain–to–source voltage and drain current that a transistor can handle safely when it is forward biased. Curves are based upon maximum peak junction temperature and a case temperature (TC) of 25°C. Peak repetitive pulsed power limits are determined by using the thermal response data in conjunction with the procedures discussed in AN569, “Transient Thermal Resistance – General Data and Its Use.” Switching between the off–state and the on–state may traverse any load line provided neither rated peak current (IDM) nor rated voltage (VDSS) is exceeded, and that the transition time (tr, tf) does not exceed 10 µs. In addition the total power averaged over a complete switching cycle must not exceed (TJ(MAX) – TC)/(R θJC). A power MOSFET designated E–FET can be safely used in switching circuits with unclamped inductive loads. For reliable operation, the stored energy from circuit inductance dissipated in the transistor while in avalanche must be less than the rated limit and must be adjusted for operating conditions differing from those specified. Although industry practice is to rate in terms of energy, avalanche energy capability is not a constant. The energy rating decreases non–linearly with an increase of peak current in avalanche and peak junction temperature. Although many E–FETs can withstand the stress of drain–to–source avalanche at currents up to rated pulsed current (IDM), the energy rating is specified at rated continuous current (ID), in accordance with industry custom. The energy rating must be derated for temperature as shown in the accompanying graph (Figure 9). Maximum energy at currents below rated continuous ID can safely be assumed to equal the values indicated. Figure 8. Capacitance Variation GATE-TO-SOURCE OR DRAIN-TO-SOURCE VOLTAGE (VOLTS) Qg, TOTAL GATE CHARGE (nC) 02 4 6 8 ID = 3 A TJ = 25°C VGS 6 3 0 12 9 24 18 12 6 0 VDS QT Q1 Q2 Q3 10 12 10 0 10 15 25 VGS VDS TJ = 25°C VDS = 0 V VGS = 0 V 1000 800 600 400 200 0 20 Ciss Coss Crss 55 Ciss Crss 30 Figure 9. Gate–to–Source and Drain–to–Source Voltage versus Total Charge 1200 |
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