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TLV751 Scheda tecnica(PDF) 22 Page - Texas Instruments |
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TLV751 Scheda tecnica(HTML) 22 Page - Texas Instruments |
22 / 31 page FB1 GND GND EN2 OUT1 IN1 OUT2 FB2 IN2 EN1 R3 CFF2 C4 R4 C3 C1 R2 Cff1 R1 C2 GND 22 TLV751 SBVS385B – DECEMBER 2019 – REVISED APRIL 2020 www.ti.com Product Folder Links: TLV751 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated 9 Power Supply Recommendations Connect a low output impedance power supply directly to the IN pin of the TLV751. 10 Layout 10.1 Layout Guidelines • Place input and output capacitors as close to the device as possible. • Use copper planes for device connections, in order to optimize thermal performance. • Place thermal vias around the device to distribute the heat. • Do not place a thermal via directly beneath the thermal pad of the DSQ package. A via can wick solder or solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder joint on the thermal pad. 10.2 Layout Example Figure 44. DSQ Package Layout Example |
Codice articolo simile - TLV751_V01 |
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Descrizione simile - TLV751_V01 |
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