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MSP430FR6007 Scheda tecnica(PDF) 27 Page - Texas Instruments

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Il numero della parte MSP430FR6007
Spiegazioni elettronici  MSP430FR600x Ultrasonic Sensing MSP430??Microcontrollers for Water?멝etering Applications
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MSP430FR6007 Scheda tecnica(HTML) 27 Page - Texas Instruments

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MSP430FR6007, MSP430FR6005
www.ti.com
SLASEV3 – MARCH 2020
Submit Documentation Feedback
Product Folder Links: MSP430FR6007 MSP430FR6005
Specifications
Copyright © 2020, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Voltages are referenced to VSS.
(3)
Voltage differences between DVCC and AVCC that exceed the specified limits can cause malfunction of the device including erroneous
writes to RAM and FRAM.
(4)
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5
Specifications
5.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage(2)
At DVCC and AVCC pins
–0.3
4.1
V
At DVCC, AVCC, and PVCC pins
–0.3
4.1
Voltage difference between DVCC and AVCC pins(3)
±0.3
V
Voltage difference among DVCC, AVCC, and PVCC pins (3)
±0.3
V
VI
Input voltage(2)
Applied to CHx_IN
–0.3
1.65
V
Applied to CHx_IN with a duty cycle of 10% over 1 ms
–0.3
1.8
Applied to USSXTIN (USSXTOUT)
–0.3
1.5
Applied to any other pin
–0.3
VCC + 0.3 V
(4.1 V Max)
Diode current at any device pin
±2
mA
Tstg
Storage temperature (4)
–40
125
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000
V may actually have higher performance.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
5.2
ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge (all
except CHx_OUT
terminals)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±250
V(ESD)
Electrostatic discharge (on
CHx_OUT terminals)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±250


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