MSP430F5310_V01 datasheet(11/109 Pages) TI1

Il numero della parte	MSP430F5310

Spiegazioni elettronici	MSP430F5310, MSP430F530x Mixed-Signal Microcontrollers

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Produttore elettronici	TI1 [Texas Instruments]

Homepage	http://www.ti.com

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DVSS1

DVCC1

P6.3/A3

P6.2/A2

P6.1/A1

P6.0/A0

AVSS1

P5.5/XOUT

P5.4/XIN

AVCC1

P5.1/A9/VeREF-

P5.0/A8/VeREF+

PJ.2/TMS

PJ.3/TCK

DVSS2

P4.5/PM_UCA1RXD/PM_UCA1SOMI

P4.6/PM_NONE

P4.7/PM_NONE

DVCC2

P4.0/PM_UCB1STE/PM_UCA1CLK

P4.1/PM_UCB1SIMO/PM_UCB1SDA

P4.2/PM_UCB1SOMI/PM_UCB1SCL

P4.3/PM_UCB1CLK/PM_UCA1STE

P4.4/PM_UCA1TXD/PM_UCA1SIMO

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MSP430F5310, MSP430F5309, MSP430F5308, MSP430F5304

www.ti.com

SLAS677G – SEPTEMBER 2010 – REVISED MAY 2020

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Product Folder Links: MSP430F5310 MSP430F5309 MSP430F5308 MSP430F5304

Terminal Configuration and Functions

Figure 4-4 shows the pinout for the MSP430F5304 device in the 48-pin RGZ and PT packages.

NOTE: For the RGZ package, TI recommends connection of exposed thermal pad to VSS.

Figure 4-4. 48-Pin RGZ or RT Package (Top View) – MSP430F5304

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