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MC-7831-HA Scheda tecnica(PDF) 2 Page - California Eastern Labs |
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MC-7831-HA Scheda tecnica(HTML) 2 Page - California Eastern Labs |
2 / 3 page MC-7831-HA Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod ucts can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. ABSOLUTE MAXIMUM RATINGS1 (TCASE= 30 °C) SYMBOLS PARAMETERS UNITS RATINGS VDD Supply Voltage V 30 VI Input Voltage2 dBmV 65 TC Operating Case Temperature °C -30 to +100 TSTG Storage Temperature °C -40 to +100 Note: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Maximum single channel power applied to the input for 1 minute with no measurable degradation in performance. SYMBOLS PARAMETERS UNITS MIN TYP MAX VDD Supply Voltage V MC-7831-HA 23.5 24.0 24.5 Vi Input Voltage1 dBmV MC-7831-HA – 21.0 27.5 TC Operating Case °C Temperature MC-7831-HA -30 +25 +85 RECOMMENDED OPERATING CONDITIONS (Zs = ZL = 75Ω) Note: 1. Test Conditions: 110 Channels, Flat PART NUMBER PACKAGE QUANTITY MC-7831-HA-AZ 7-pin special with heatsink 50pcs max/ Tray ORDERING INFORMATION 1. The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress on the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended space is 2.0 to 3.0 mm typical. 2. Recommended torque strength of the screw is 59 to 78 Ncm. 3. Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference. NOTES ON CORRECT USE This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recom- mended conditions are to be consulted with our sales representa- tives. RECOMMENDED SOLDERING CONDITIONS Soldering Soldering Condition Method Conditions Symbol Pin Part Heating Pin area temperature: less – than 260°C1 Hour: Within 2 sec./pin Note. 1. The point of pin part heating must be kept at a distance of more than 1.2 mm from the root of lead. A Business Partner of NEC Compound Semiconductor Devices, Ltd. 10/03/2005 IDD Operating Current mA 180 – 240 RF OFF CTB Composite Triple Beat dBc – – -57 f = 40 to 870 MHz; 110 Channels, VOUT = 44 dBmV, Flat XMod Cross Modulation dBc – – -50 CSO Composite Second Order dBc – – -57 ELECTRICAL CHARACTERISTICS (TA= 30±5 °C, VDD = 24 V, ZS = ZL = 75 Ω) |
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