MC10E154 MC100E154

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Condition

IIH

Input HIGH Current

150

150

150

µA

IEE

Power Supply Current

mA

10E

76

91

76

91

76

91

100E

76

91

76

91

87

105

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Condition

tPLH

Propagation Delay to Output

ps

tPHL

D

325

500

700

325

500

700

325

500

700

SEL

475

650

925

475

650

925

475

650

925

LEN

350

500

750

350

500

750

350

500

750

MR

450

600

800

450

600

800

450

600

800

ts

Setup Time

ps

D

300

100

300

100

300

100

SEL

500

250

500

250

500

250

th

Hold Time

ps

D

300

–100

300

–100

300

–100

SEL

200

– 250

200

– 250

200

– 250

tRR

Reset Recovery Time

800

600

800

600

800

600

ps

tPW

Minimum Pulse Width

ps

MR

400

400

400

tSKEW

Within-Device Skew

50

50

50

ps

1

tr

Rise/Fall Times

ps

tf

20 - 80%

300

475

800

300

475

800

300

475

800

1. Within-device skew is defined as identical transitions on similar paths through a device.