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S-19212B Scheda tecnica(PDF) 36 Page - ABLIC Inc. |
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S-19212B Scheda tecnica(HTML) 36 Page - ABLIC Inc. |
36 / 60 page (4) 1 2 3 4 (5) 1 2 3 4 Board D Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Pattern for heat radiation: 2000mm 2 t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 Thermal via - Board E Item Specification Size [mm] 114.3 x 76.2 x t1.6 74.2 x 74.2 x t0.070 Thermal via Number: 4 Diameter: 0.3 mm Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Pattern for heat radiation: 2000mm 2 t0.070 IC Mount Area enlarged view HTMSOP-8 Test Board No. HTMSOP8-A-Board-SD-1.0 enlarged view ABLIC Inc. |
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