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BYW29ED-200 Scheda tecnica(PDF) 4 Page - WeEn Semiconductors |
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BYW29ED-200 Scheda tecnica(HTML) 4 Page - WeEn Semiconductors |
4 / 11 page WeEn Semiconductors BYW29ED-200 Ultrafast power diode BYW29ED-200 All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2018. All rights reserved Product data sheet 26 September 2018 4 / 11 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base with heatsink compound; Fig. 3 - - 2.7 K/W Rth(j-a) thermal resistance from junction to ambient free air in free air; Fig. 4 [1] - 50 - K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin plated and standard footprint 003aac673 10-2 10-1 1 10 Zth(j-mb) (K/W) 10-3 tp (s) 10-5 10 1 10-1 10-4 10-2 10-3 tp tp T P t T δ = Fig. 3. Transient thermal impedance from junction to mounting base as a function of pulse width 001aab021 7.0 7.0 4.57 2.5 2.15 1.5 Fig. 4. SOT428: minimum pad sizes for surface- mounting |
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