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TS5A23166DCUR Scheda tecnica(PDF) 1 Page - Texas Instruments |
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TS5A23166DCUR Scheda tecnica(HTML) 1 Page - Texas Instruments |
1 / 22 page www.ti.com FEATURES APPLICATIONS SSOP OR VSSOP PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 NO1 COM1 IN2 GND COM2 IN1 V+ NO2 YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) GND IN1 COM2 V+ 1 2 3 4 8 7 5 6 IN2 COM1 NO1 NO2 DESCRIPTION/ORDERING INFORMATION TS5A23166 0.9- Ω DUAL SPST ANALOG SWITCH 5-V/3.3-V 2-CHANNEL ANALOG SWITCH SCDS196 – MAY 2005 • Cell Phones • Isolation in Powered-Down Mode, V+ = 0 • PDAs • Low ON-State Resistance (0.9 Ω) • Portable Instrumentation • Control Inputs Are 5.5-V Tolerant • Audio and Video Signal Routing • Low Charge Injection • Low-Voltage Data-Acquisition Systems • Excellent ON-State Resistance Matching • Communication Circuits • Low Total Harmonic Distortion (THD) • Modems • 1.65-V to 5.5-V Single-Supply Operation • Hard Drives • Latch-Up Performance Exceeds 100 mA Per • Computer Peripherals JESD 78, Class II • Wireless Terminals and Peripherals • ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) The TS5A23166 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) TS5A23166YEPR PACKAGE PREVIEW 0.23-mm Large Bump – YEP Tape and reel NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP TS5A23166YZPR PACKAGE PREVIEW –40 °C to 85°C (Pb-free) SSOP – DCT Tape and reel TS5A23166DCTR PACKAGE PREVIEW VSSOP – DCU (Pb-free) Tape and reel TS5A23166DCUR JAM_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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