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GD25D10CPFG Datasheet(Scheda tecnica) 2 Page - GigaDevice Semiconductor (Beijing) Inc.

Numero della parte GD25D10CPFG
Dettagli  3.3V Uniform Sector Standard and Dual Serial Flash
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Produttore  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
Homepage  http://www.gigadevice.com/
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3.3V Uniform Sector
Standard and Dual Serial Flash
GD25D10C/05C
2
CONTENTS
1.
FEATURES ................................................................................................................................................................ 4
2.
GENERAL DESCRIPTION ..................................................................................................................................... 5
3.
MEMORY ORGANIZATION .................................................................................................................................. 7
4.
DEVICE OPERATION ............................................................................................................................................. 8
5.
DATA PROTECTION ............................................................................................................................................... 9
6.
STATUS REGISTER ............................................................................................................................................... 10
7.
COMMANDS DESCRIPTION............................................................................................................................... 11
7.1.
WRITE ENABLE (WREN) (06H) ......................................................................................................................... 13
7.2.
WRITE DISABLE (WRDI) (04H) ......................................................................................................................... 13
7.3.
READ STATUS REGISTER (RDSR) (05H)............................................................................................................. 13
7.4.
WRITE STATUS REGISTER (WRSR) (01H) .......................................................................................................... 14
7.5.
READ DATA BYTES (READ) (03H)..................................................................................................................... 15
7.6.
READ DATA BYTES AT HIGHER SPEED (FAST READ) (0BH)................................................................................ 15
7.7.
DUAL OUTPUT FAST READ (3BH) ...................................................................................................................... 16
7.8.
PAGE PROGRAM (PP) (02H)................................................................................................................................ 16
7.9.
SECTOR ERASE (SE) (20H)................................................................................................................................. 17
7.10.
32KB BLOCK ERASE (BE) (52H) ....................................................................................................................... 18
7.11.
64KB BLOCK ERASE (BE) (D8H) ...................................................................................................................... 18
7.12.
CHIP ERASE (CE) (60/C7H)................................................................................................................................ 19
7.13.
DEEP POWER-DOWN (DP) (B9H) ....................................................................................................................... 19
7.14.
RELEASE FROM DEEP POWER-DOWN / READ DEVICE ID (ABH)........................................................................ 20
7.15.
READ MANUFACTURE ID/ DEVICE ID (REMS) (90H)........................................................................................ 21
7.16.
READ IDENTIFICATION (RDID) (9FH) ................................................................................................................ 21
8.
ELECTRICAL CHARACTERISTICS.................................................................................................................. 23
8.1.
POWER-ON TIMING ....................................................................................................................................... 23
8.2.
INITIAL DELIVERY STATE ............................................................................................................................ 23
8.3.
ABSOLUTE MAXIMUM RATINGS ............................................................................................................... 23
8.4.
CAPACITANCE MEASUREMENT CONDITIONS ........................................................................................ 24
8.5.
DC CHARACTERISTICS................................................................................................................................. 25
8.6.
AC CHARACTERISTICS................................................................................................................................. 28
9.
ORDERING INFORMATION ............................................................................................................................... 32
9.1.
VALID PART NUMBERS........................................................................................................................................ 33
10.
PACKAGE INFORMATION ............................................................................................................................. 35
10.1.
PACKAGE SOP8 150MIL.................................................................................................................................... 35
10.2.
PACKAGE SOP8 208MIL.................................................................................................................................... 36
10.3.
PACKAGE TSSOP8 173MIL ............................................................................................................................... 37
10.4.
PACKAGE DIP8 300MIL..................................................................................................................................... 38




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