0.5W Zener Diode - BZX55A* series

Tight tolerance reverse breakdown voltage

Larger die size for dissipation

 

Sharp reverse characteristics & low reverse current

High reliability gold back metal

Rev 1.0

07/04/19

CHIP BACKSIDE IS CATHODE

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-750 /2073 Visual Inspection

“H” - MIL-STD-750 /2073 Visual Inspection

+ MIL-PRF-38534 Class H LAT

450 (17.72)

270 (10.6)

ANODE

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

LAT = Lot Acceptance Test.

“K” - MIL-STD-750 /2072 Visual Inspection

+ MIL-PRF-38534 Class K LAT

Features:

Die Dimensions in µm (mils)

Die Size (Unsawn)

450 x 450

17.72 x 17.72

µm

mils

Anode Pad Size

235 x 235

9.25 x 9.25

µm

mils

Die Thickness

200

7.87

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µm

mils

Top Metal Composition

Al

Back Metal Composition

Au

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (400 per tray capacity)

Sawn Wafer on Tape – By specific request

Unsawn Wafer – By specific request

2% - B grade, 5% - C grade