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DR73-R33-R Datasheet(Scheda tecnica) 9 Page - Eaton All Rights Reserved.

Numero della parte DR73-R33-R
Dettagli  High power density, high efficiency, shielded drum core power inductors
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Produttore  EATON [Eaton All Rights Reserved.]
Homepage  https://www.eaton.com
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Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved Printed in USA
Publication No. 4315 BU-SB14112
September 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder Reflow Profile
t
tP
ts
TC -5°C
Time 25°C to Peak
Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TTaabbllee 1
1 -- S
Sttaannddaarrdd S
SnnP
Pbb S
Soollddeerr ((TTcc))
Volume
Volume
Package
mm
3
mm
3
Thickness
<350
_
>350
<2.5mm
235°C
220°C
_
>2.5mm
220°C
220°C
TTaabbllee 2
2 -- LLeeaadd ((P
Pbb)) FFrreeee S
Soollddeerr ((TTcc))
Volume
Volume
Volume
Package
mm
3
mm
3
mm
3
Thickness
<350
350 - 2000
>2000
<1.6mm
260°C
260°C
260°C
1.6 – 2.5mm 260°C
250°C
245°C
>2.5mm
250°C
245°C
245°C
Reference JDEC J-STD-020
Standard SnPb Solder
Lead (Pb) Free Solder
Profile Feature
Preheat and Soak• e
T mperature min. (Tsmin)
100°C
150°C
• Temperature max. (Tsmax)
150°C
200°C
• Time (Tsmin to Tsmax) (ts)
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
217°C
60-150 Seconds
60-150 Seconds
Table 1
able 2
T
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Minutes Max.
6
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Technical Data 4315
Effective September 2017
DR
High power density, high efficiency, shielded drum core power inductors




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