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KFM1216Q2M Scheda tecnica(PDF) 6 Page - Samsung semiconductor |
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KFM1216Q2M Scheda tecnica(HTML) 6 Page - Samsung semiconductor |
6 / 88 page MuxOneNAND512(KFM1216Q2M) FLASH MEMORY 6 Document Title MuxOneNAND 0. Revision History The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near you. Revision No. 0.0 0.1 0.2 1.0 Remark Preliminary Final Draft Date Jan. 28, 2004 Feb. 4, 2004 July. 2, 2004 Aug. 5, 2004 History Initial issue. 1. Excluded Cache Program Operation 2. Added the descriptions for below operations -. Reset -. Write Protection -. Burst Read Latency -. Dual Operation -. Invalid block definition and Identification method -. Error in write or read operation -. ECC 3. Revised program sequence 1. Added Table of Contents 2. Corrected the errata 3. Added Data Protection Scheme during Power-down 4. ECC description is revised. 5. Revised Read while Load and Write While Program diagram. 6. Added OTP description 7. Revised OTP Flow Chart 8. Added Spare Assignment information 9. Added NAND Array Memory Map 10. Added DC/AC parameters 11. Added the Addressing for program operation 12. Added INT guidance 13. Added Write While Load and Read While Program Chapter 14. Revised tRD1 typical value from 35ns to 38ns 15. Revised tRD2 typical value from 75ns to 85ns 1. Corrected the errata 2. Deleted BootRAM unlock operation 3. Revised Write Protect Status description 4. Revised OTP access command as 2 cycle 5. Revised dual operation diagram 6. Revised power-down voltage detector level 7. Revised tRD1 typical value from 38ns to 35ns 8. Revised tRD2 typical value from 85ns to 75ns 9. Deleted tOEH in asynchronous read operation 10. Revised Write Protection status description 11. Added INT bit status in Cold Reset operation 12. Moved Interrupt register setting before inputting command in all flow charts 13. Revised Dual operation diagrams 14. Added the tREADY parameter in Hot Reset operation |
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