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ML2500 Scheda tecnica(PDF) 6 Page - OKI electronic componets |
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ML2500 Scheda tecnica(HTML) 6 Page - OKI electronic componets |
6 / 7 page ¡ Semiconductor ML2500 6/7 FEDL2500-01 PACKAGE DIMENSIONS (Unit : mm) Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). TSOP I32-P-814-0.50-1K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Oki Electric Industry Co., Ltd. Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5 mm) 0.27 TYP. 3/Dec. 10, 1996 |
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