NBSG53A

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4

Table 5. ATTRIBUTES

Characteristics

Value

2.375 V to 3.465 V

−2.375 V to −3.465 V

Internal Input Pulldown Resistor (R, SEL)

75 k

W

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 1.5 kV

> 50 V

> 4 kV

Moisture Sensitivity (Note 5)

16−FCBGA

16−QFN

Level 3

Level 1

Flammability Rating

UL 94 V−0 @ 0.125 in

Oxygen Index

28 to 34

Transistor Count

482

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

5. For additional information, refer to Application Note AND8003/D.

Table 6. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

Positive Power Supply

3.6

V

Negative Power Supply

−3.6

V

Positive Input

Negative Input

3.6

−3.6

V

V

Differential Input Voltage

|D − D|

2.8 V

2.8

V

V

Static

Surge

45

80

mA

mA

Output Current

Continuous

Surge

25

50

mA

mA

Operating Temperature Range

16 FCBGA

16 QFN

−40 to +70

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction−to−Ambient)

(Note 6)

0 LFPM

500 LFPM

0 LFPM

500 LFPM

16 FCBGA

16 FCBGA

16 QFN

16 QFN

108

86

41.6

35.2

°C/W

°C/W

°C/W

°C/W

Thermal Resistance (Junction−to−Case)

2S2P (Note 6)

2S2P (Note 7)

16 FCBGA

16 QFN

5.0

4.0

°C/W

°C/W

Wave Solder

< 15 Seconds

225

°C

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

6. JEDEC standard 51−6, multilayer board − 2S2P (2 signal, 2 power).

7. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.