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MCRF202 Scheda tecnica(PDF) 9 Page - Microchip Technology |
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MCRF202 Scheda tecnica(HTML) 9 Page - Microchip Technology |
9 / 20 page 2003 Microchip Technology Inc. DS21308E-page 9 MCRF202 3.0 MECHANICAL SPECIFICATIONS FOR DIE AND WAFER FIGURE 3-1: DIE PLOT TABLE 3-1: PAD COORDINATES ( µM) TABLE 3-2: PAD FUNCTION TABLE VB VA VSS VCC SENSOR TEST Passivation Openings Pad Name Pad Width Pad Height Pad Center X Pad Center Y VA 90.0 90.0 427.50 -734.17 VB 90.0 90.0 -408.60 -734.17 VSS 105.3 112.5 -417.60 722.47 VCC 90.0 90.0 -164.70 723.82 SENSOR 90.0 90.0 69.30 723.82 TEST 90.0 90.0 325.35 723.82 Note 1: All coordinates are referenced from the center of the die. 2: Die size: 1.1215 mm x 1.7384 mm. Name Function VA, VB Coil and capacitor connections VSS Device ground VCC DC supply out from device SENSOR Sensor input TEST Do Not Connect, Test pin |
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