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FAN8741/FAN8742 Rev. 1.0.1

1. 56-TSSOP-EP, Case 1: Single layer PCB with 1 signal plane only, PCB size is 76mm

× 114mm × 1.6mm.

2. 56-TSSOP-EP, Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size is 76mm

× 114mm × 1.6mm, Cu

plane sizes for power and ground is 74mm

× 62mm × 0.035mm. Down pad of IC is soldered on the PCB.

3. 56-TSSOP-EP, Case 3: PCB condition is same to case 2 except via holes, which penetrate PCB all layers. Down pad of IC is sol-

dered on the PCB.

4. 56-SSOP-HS, Case 1: Single layer PCB with 1 signal plane only, PCB size is 76mm

× 114mm × 1.6mm.

5. 56-SSOP-HS, Case 2: Multi layer PCB with 1 signal, 1 power and 1 ground planes, PCB size is 76mm

× 114mm × 1.6mm, Cu

plane sizes for power and ground is 74mm

× 62mm × 0.035mm.

6. Power dissipation is reduced by -12.8mW/

°C for using above Ta=25°C in 56-TSSOP-EP, case 1.

7. Power dissipation is reduced by -25.6mW/

°C for using above Ta=25°C in 56-TSSOP-EP, case 2.

8. Power dissipation is reduced by -32.8mW/

°C for using above Ta=25°C in 56-TSSOP-EP, case 3.

9. Power dissipation is reduced by -24.8mW/

°C for using above Ta=25°C in 56-SSOP-HS, case 1.

10. Power dissipation is reduced by -37.6mW/

°C for using above Ta=25°C in 56-SSOP-HS, case 2.

Power Dissipation Curve

Recommended Operating Conditions (Ta = 25

°C)

Parameter

Min.

Typ.

Max.

Unit

Supply Voltage (Spindle Signal block)

4.5

5

5.5

V

Supply Voltage (Digital block)

4.5

5

5.5

V

Supply Voltage (Spindle driver)

4.5

12

13.2

V

Supply Voltage (Sled driver)

4.5

12

13.2

V

Supply Voltage (BTL driver)

4.5

12

V

Supply Voltage (BTL signal block)

4.5

12

13.2

V

Output current(Spindle)

-

1.0

1.5

A

Output current(Focus, Tracking, Loading)

-

0.5

0.8

A

Output current(Sled)

-

0.5

0.8

A

25

50

75

100

125

150

175

1

2

3

4

5

Power dissipation, [W]

SOA

56-SSOP-HS,case2

56-TSSOP-EP,case3

56-TSSOP-EP,case2

56-SSOP-HS,case1

56-TSSOP-EP,case1