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FAN3223 Scheda tecnica(PDF) 21 Page - ON Semiconductor

Il numero della parte FAN3223
Spiegazioni elettronici  Dual 4-A High-Speed, Low-Side Gate Drivers
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Produttore elettronici  ONSEMI [ON Semiconductor]
Homepage  http://www.onsemi.com
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Applications Information
Input Thresholds
Each member of the FA N322x driver family consists of
tw o identical channels that may be used independently
at rated current or connected in parallel to double the
individual
current capacity.
In the
FA N3223
and
FA N3224, channels A and B can be enabled or disabled
independently using ENA or ENB, respectively. The EN
pin has TTL thresholds for parts w ith either CMOS or
TTL input thresholds.
If
ENA
and
ENB are not
connected, an internal pull-up resistor enables the dr iver
channels by default. ENA and ENB have TTL thresholds
in parts w ith either TTL or CMOS INx threshold. If the
channel A and channel B inputs and outputs are
connected in parallel to increase the driver current
capacity, ENA and ENB should be connected and
driven together.
The FA N322x family offers versions in either TTL or
CMOS input thresholds. In the FA N322x T, the input
thresholds meet industry-standard TTL-logic thresholds
independent of
the VDD voltage, and there
is
a
hysteresis voltage of approximately 0.4 V. These levels
per mit the inputs to be driven from a range of input logic
signal levels for w hich a voltage over 2 V is considered
logic HIGH. The driving signal for the TTL inputs should
have fast rising and falling edges w ith a slew rate of
6 V/µs or faster, so a r ise time from 0 to 3.3 V should be
550 ns or less. With reduced slew rate, circuit noise
could cause the driver input voltage to exceed the
hysteresis voltage and retrigger the dr iver input, causing
erratic operation.
In the FA N322x C, the logic
input thresholds are
dependent on the VDD level and, w ith VDD of 12V, the
logic rising edge threshold is approximately 55% of VDD
and the input falling edge threshold is approximately
38% of VDD. The CMOS input configuration offers a
hysteresis voltage of approximately 17% of VDD. The
CMOS inputs can be used w ith relatively s low edges
(approaching DC)
if good decoupling and bypass
techniques are incorporated in the system design to
prevent noise from violating the input voltage hysteresis
w indow . This allow s setting precise timing intervals by
fitting an R- C c ircuit betw een the controlling signal and
the IN pin of the dr iver. The s low rising edge at the IN
pin of the driver introduces a delay betw een the
controlling signal and the OUT pin of the driver.
Static Supply Current
In the IDD (static) typical performance characteristics
(Figure 12 - Figure 14 and Figure 19 - Figure 21), the
curve is produced w ith all inputs/enables floating (OUT
is low ) and indicates the low est static IDD current for the
tested configuration. For other states, additional current
flow s through the 100 k
Ω resistors on the inputs and
outputs show n in the block diagram of each part (see
Figure 5 - Figure 7). In these cases, the actual static IDD
current is the value obtained from the curves plus this
additional current.
M illerDrive™ Gate Drive Technology
FA N322x gate drivers incorporate the Miller Drive™
architecture show n in Figure 48. For the output stage, a
combination of bipolar and MOS devices provide large
currents over a w ide range of supply voltage and
temperature variations. The bipolar devices carry the
bulk of the current as OUT sw ings betw een 1/3 to 2/3
VDD and the MOS dev ices pull the output to the HIGH or
LOW rail.
The purpose of the Miller Drive™ architecture is to
speed up sw itching by providing high current during the
Miller plateau region w hen the gate-drain capacitance of
the MOSFET is being charged or discharged as part of
the turn-on / turn-off process.
For applications that have zero voltage sw itching during
the MOSFET turn-on or turn-off interval, the driver
supplies high peak current for fast sw itching even
though the Miller plateau is not present. This situation
often
occurs
in
synchronous
rectifier
applications
because the body diode is generally conducting before
the MOSFET is sw itched ON.
The output pin slew rate is determined by VDD voltage
and the load on the output. It is not user adjustable, but
a series resistor can be added if a slow er rise or fall time
at the MOSFET gate is needed.
Input
stage
V
DD
V
OUT
Figure 48.
MillerDrive™ Output Architecture
Under-Voltage Lockout
The FAN322x startup logic is optimized to drive ground-
referenced N-channel MOSFETs w ith an under-voltage
lockout ( UVLO) function to ensure that the IC starts up
in an orderly fashion. When VDD is rising, yet below the
UVLO
level,
this
circuit
holds
the
output
LOW,
regardless of the status of the input pins. After the part
is active, the supply voltage must drop 0.2 V before the
part shuts dow n. This hysteresis helps prevent chatter
w hen low VDD supply voltages have noise from the
pow er sw itching. This configuration is not suitable for
driving high-side P-channel MOSFETs because the low
output voltage of the driver w ould turn the P-channel
MOSFET ON w ith VDD below the UVLO level.


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