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LTM8068 Scheda tecnica(PDF) 15 Page - Linear Technology

Il numero della parte LTM8068
Spiegazioni elettronici  2.8VIN to 40VIN Isolated 關Module DC/DC Converter
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Produttore elettronici  LINER [Linear Technology]
Homepage  http://www.linear.com
Logo LINER - Linear Technology

LTM8068 Scheda tecnica(HTML) 15 Page - Linear Technology

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LTM8067
15
8067fc
For more information www.linear.com/LTM8067
APPLICATIONS INFORMATION
confusion andinconsistency.Thesedefinitionsaregivenin
JESD 51-12, and are quoted or paraphrased as follows:
θJA is the natural convection junction-to-ambient air
thermal resistance measured in a one cubic foot sealed
enclosure. This environment is sometimes referred to
as still air although natural convection causes the air to
move. This value is determined with the part mounted to a
JESD 51-9 defined test board, which does not reflect an
actual application or viable operating condition.
θJCbottom is the junction-to-board thermal resistance with
allofthecomponentpowerdissipationflowingthroughthe
bottom of the package. In the typical µModule converter,
the bulk of the heat flows out the bottom of the package,
but there is always heat flow out into the ambient envi-
ronment. As a result, this thermal resistance value may
be useful for comparing packages but the test conditions
don’t generally match the user’s application.
θJCtopisdeterminedwithnearlyallofthecomponentpower
dissipation flowing through the top of the package. As the
electricalconnectionsofthetypicalµModuleconverterare
on the bottom of the package, it is rare for an application
to operate such that most of the heat flows from the junc-
tion to the top of the part. As in the case of θJCbottom, this
value may be useful for comparing packages but the test
conditions don’t generally match the user’s application.
θJCboardisthejunction-to-boardthermalresistancewhere
almost all of the heat flows through the bottom of the
µModule converter and into the board, and is really the
sum of the θJCbottom and the thermal resistance of the
bottom of the part through the solder joints and through a
portion of the board. The board temperature is measured
a specified distance from the package, using a two-sided,
two-layer board. This board is described in JESD 51-9.
Giventhesedefinitions,itshouldnowbeapparentthatnone
of these thermal coefficients reflects an actual physical
operating condition of a µModule converter. Thus, none
of them can be individually used to accurately predict the
thermal performance of the product. Likewise, it would
be inappropriate to attempt to use any one coefficient to
correlate to the junction temperature vs load graphs given
in the product’s data sheet. The only appropriate way to
use the coefficients is when running a detailed thermal
analysis, such as FEA, which considers all of the thermal
resistances simultaneously.
A graphical representation of these thermal resistances
is given in Figure 3.
The blue resistances are contained within the µModule
converter, and the green are outside.
The die temperature of the LTM8067 must be lower than
the maximum rating of 125°C, so care should be taken in
the layout of the circuit to ensure good heat sinking of the
LTM8067. The bulk of the heat flow out of the LTM8067
is through the bottom of the module and the BGA pads
into the printed circuit board. Consequently a poor printed
circuit board design can cause excessive heating, result-
ing in impaired performance or reliability. Please refer to
the PCB Layout section for printed circuit board design
suggestions.
Figure 3. Approximate Thermal Model of LTM8067
8067 F03
µMODULE DEVICE
JUNCTION-TO-CASE (TOP)
RESISTANCE
JUNCTION-TO-BOARD RESISTANCE
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
CASE (TOP)-TO-AMBIENT
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
JUNCTION
AMBIENT
CASE (BOTTOM)-TO-BOARD
RESISTANCE


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