Motore di ricerca datesheet componenti elettronici |
|
LTM8003 Scheda tecnica(PDF) 24 Page - Linear Technology |
|
LTM8003 Scheda tecnica(HTML) 24 Page - Linear Technology |
24 / 30 page LTM8003 24 8003fc For more information www.linear.com/LTM8003 APPLICATIONS INFORMATION θJCtopisdeterminedwithnearlyallofthecomponentpower dissipation flowing through the top of the package. As the electrical connections of the typical µModule regulator are on the bottom of the package, it is rare for an application to operate such that most of the heat flows from the junc- tion to the top of the part. As in the case of θJCbottom, this value may be useful for comparing packages but the test conditions don’t generally match the user’s application. θJB is the junction-to-board thermal resistance where almost all of the heat flows through the bottom of the µModule regulator and into the board, and is really the sum of the θJCbottom and the thermal resistance of the bottom of the part through the solder joints and through a portion of the board. The board temperature is measured a specified distance from the package, using a two sided, two layer board. This board is described in JESD 51-9. Giventhesedefinitions,itshouldnowbeapparentthatnone of these thermal coefficients reflects an actual physical operating condition of a µModule regulator. Thus, none of them can be individually used to accurately predict the thermal performance of the product. Likewise, it would be inappropriate to attempt to use any one coefficient to correlate to the junction temperature vs load graphs given in the product’s data sheet. The only appropriate way to use the coefficients is when running a detailed thermal analysis, such as FEA, which considers all of the thermal resistances simultaneously. A graphical representation of these thermal resistances is given in Figure 6. The blue resistances are contained within the µModule regulator, and the green are outside. The die temperature of the LTM8003 must be lower than the maximum rating, so care should be taken in the layout of the circuit to ensure good heat sinking of the LTM8003. The bulk of the heat flow out of the LTM8003 is through the bottom of the package and the pads into the printed circuit board. Consequently a poor printed circuit board design can cause excessive heating, resulting in impaired performance or reliability. Please refer to the PCB Layout section for printed circuit board design suggestions. 8003 F06 µMODULE DEVICE JUNCTION-TO-CASE (TOP) RESISTANCE JUNCTION-TO-BOARD RESISTANCE JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD) CASE (TOP)-TO-AMBIENT RESISTANCE BOARD-TO-AMBIENT RESISTANCE JUNCTION-TO-CASE (BOTTOM) RESISTANCE JUNCTION AMBIENT CASE (BOTTOM)-TO-BOARD RESISTANCE Figure6. Graphical Representation of the Thermal Resistances Between the Device Junction and Ambient |
Codice articolo simile - LTM8003 |
|
Descrizione simile - LTM8003 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEETIT.COM |
Lei ha avuto il aiuto da alldatasheet? [ DONATE ] |
Di alldatasheet | Richest di pubblicita | contatti | Privacy Policy | scambio Link | Ricerca produttore All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |