Fixed Attenuator Die

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Notes

A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.

B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.

C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled

to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp

Absolute Maximum Ratings

Operating Temperature (ground)

-40°C to 85°C

RF Input Power

2W

Permanent damage may occur if any of these limits are exceeded.

Electrical Specifications at 25°C, 50Ω

Parameter

Condition (GHz)

Min.

Typ.

Max.

Unit

Frequency Range

DC

26.5

GHz

DC - 5

3.0

dB

5 - 15

3.2

15 - 18

3.3

18 - 26.5

3.6

DC - 5

1.1

:1

5 - 15

1.3

15 - 18

1.4

18 - 26.5

1.5

25°C

DC - 18

2

W

85°C

DC - 18

1

W

YAT-3-D+

Die Layout

Critical Dimensions

Parameter

Values

Die Thickness, µm

100

Die Width, µm

725

Die Length, µm

700

RF IN and RF OUT Bond Pad Size, µm

110 x 75

Ground Bond Pad Size, µm

110 x 150

Fig 3. Bonding Pad Positions

Bonding Pad Position

(Dimensions in µm, Typical)

Fig 2. Die Layout

3dB

3dB

1. Electrical specifications are typical measured characteristics on die using MPI Titan Series 250 µm pitch GSG probe.

2. Tested in industry standard 2x2 mm, 6-lead MCLP package.