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Motore di ricerca datesheet componenti elettronici |
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Motore di ricerca datesheet componenti elettronici |
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LAM676 Scheda tecnica(PDF) 11 Page - OSRAM GmbH |
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LAM676 Scheda tecnica(HTML) 11 Page - OSRAM GmbH |
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11 / 20 page  Version 1.3 LA M676 2014-10-30 11 Recommended Solder Pad 9) page 19 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 19 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) |
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